Unlock Your Data Center'sFull Potential
As the demand for computational power grows at an incredible pace, industries are scrambling to find new technologies for effective data processing. Companies seek solutions that enable artificial intelligence to bring immense benefits to their operations.
Actasys provides an optimal thermal environment for high-rate data transfer and processing components including Network Interface Cards (NICs), Data Processing Units (DPUs), and Switches, ensuring peak operational effectiveness.
ActaJet™ Technology
A groundbreaking cooling solution engineered for data centers that seamlessly integrates into high-density server racks for maximum performance. Our advanced technology delivers comprehensive cooling for all mission-critical components including Network Interface Cards (NICs), Data Processing Units (DPUs), and Switches.
High-efficiency Air Jets
Spot-on cooling with turbulent air jets of up to 80 m/s.
Ultra-Compact Design
Less than 3mm thick, perfect for 1U/2U dense server environments.
Energy Efficient
Only 2-3W power consumption, minimizing overall data center energy usage.
Smart Cooling
Software-driven system that adapts dynamically based on demand.
Applications
Discover how Actasys solutions address critical thermal challenges across different applications.
Communication Network
Rising data speeds and the imperative of connectivity lead to overheating in optical cables and server ports. The impact is a major operational bottleneck for data centers, limiting scalability and efficiency. By eliminating overheating issues in cable ports, Actasys enhances computational power by unlocking the full potential of electronics enabling communication crucial for running advanced AI models.
Printed Circuit Boards
PCBs host central processing units (CPUs), memory modules (RAM), and other processing elements. To meet computation power demands, space available for cooling is constantly reduced. Using our small form actuators for spot-on cooling enables unlocking CPU's computational power under high ambient temperatures, allowing gains on individual PCB level as well as stacking more PCBs, to increase overall computation power density.
Get in Touch
Ready to optimize your data center's cooling efficiency? Contact us today.